Printed Circuit Board Dry Film Laminator
This printed circuit board dry film laminator is a device for bonding photosensitive resist film to printed circuit boards. It features a compact design, and...
●Effective width: 100 to 550 mm ●Speed: 0 to 3.0 m/min ●Pressurization method: Air cylinder pressurization ●Temperature control range: Room temperature to 150°C ●Machine dimensions: W1110 × D1200 × H1220 mm ●Air source: 0.5 MPa or higher ●Power supply: φ3 200V 9.5 kW ●Weight: 280 kg
- Company：エム・シー・ケー 東京 電子事業本部
- Price：Other
